Feb 25, 2026

InnoComm to Showcase Edge AI Platform at Embedded World 2026

InnoComm, a leading ODM provider of intelligent embedded and Edge AI solutions, will participate in Embedded World 2026, taking place from March 9 to March 11 in Nuremberg, Germany. InnoComm will co-exhibit with MediaTek at Hall 3, Booth 3-539, demonstrating its latest Edge AI innovations.

 

At the show, InnoComm will unveil Arkeon, its newest Edge AI Box platform supports four compute platform series, designed to deliver scalable AI performance of up to 10 TOPS, depending on the selected compute platform. Arkeon is engineered for real-time AI inference at the edge, targeting applications such as smart retail, smart manufacturing, smart transportation, and AIoT deployments.

 

Arkeon Powered by the Latest MediaTek Genio 360(P)

 

One of the highlighted designs is built on MediaTek’s latest Genio 360(P) platform, bringing enhanced AI acceleration, power efficiency, and multimedia capabilities to edge deployments. The Genio 360(P) is optimized for Edge AI and AIoT applications, supporting advanced computer vision, multi-camera processing, and real-time analytics while maintaining low power consumption.

 

By leveraging the Genio 360(P), InnoComm enables customers to rapidly develop and deploy intelligent edge systems with a balanced combination of AI performance, thermal efficiency, and industrial reliability, making it ideal for always-on edge scenarios.

 

Touch Panel and Display Options for Maximum Flexibility

 

Arkeon is designed with versatile display interface options, supporting touch panel screens from 7-inch and 10-inch standard sizes, while also allowing fully customized displays up to 32 inches. This flexibility enables developers to tailor Arkeon solutions for diverse use cases, including interactive kiosks, smart factory control panels, retail self-service terminals, and large-scale digital signage.

 

Whether it’s compact edge devices or large-format interactive systems, InnoComm provides the design and integration expertise to ensure seamless performance and an intuitive user experience.

 

Why Choose InnoComm as Your ODM Partner

 

With decades of embedded system expertise, InnoComm offers end-to-end ODM services that go beyond hardware design:

 

  • Platform Flexibility: Multi-platform support across leading SoC ecosystems, including close collaboration with MediaTek
  • Strong Engineering Capability: Proven experience in Edge AI, embedded computing, and industrial-grade system design
  • ODM Customization & Scalability: From concept design and hardware/software integration to mass production
  • Long-term Lifecycle Support: Industrial reliability, stable supply planning, and long product lifecycle management
  • Fast Time-to-Market: Optimized reference designs and deep ecosystem partnerships accelerate deployment

 

By combining scalable AI performance with ODM flexibility, InnoComm empowers customers to bring differentiated Edge AI products to market faster and more efficiently.

 

Visit Us at Embedded World 2026

InnoComm warmly invites visitors to Hall 3, Booth 3-539 to experience Arkeon firsthand and explore how InnoComm’s ODM capabilities can support next-generation Edge AI solutions.