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From Edge to Cloud—and Back to the Field: How Physical AI Is Shaping the Next Generation of AIoT Devices
From heterogeneous computing and model optimization to secure deployment, discover how AI closes the loop from perception to understanding and action
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13 MAR 2026USTV Features InnoComm's Edge AI Solutions at Embedded World Exhibition & Conference 2026 -
06 MAR 2026InnoComm Secures Exclusive Development and Sales Rights for MediaTek Genio 360 EVK to Accelerate Edge AIoT and GenAI Innovation -
25 FEB 2026InnoComm to Showcase Edge AI Platform at Embedded World 2026Co-exhibiting with MediaTek at Hall 3, Booth 3-539
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10 FEB 2026IoT通信プロトコル選定：システムアーキテクチャ視点から見るMQTT・HTTP・CoAPはじめに：通信プロトコルは機能選択ではなく、アーキテクチャ設計である
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29 JAN 2026エンベデッドモジュール（組込みモジュール）とは？産業別アプリケーション特性と選定ガイド
—— エンジニアと調達の視点から導き出す意思決定フレームワーク -
20 JAN 2026InnoComm Launches MediaTek Genio 360 EVK to Accelerate Edge GenAI and Scalable AIoT DevelopmentInnoComm Mobile Technology today announced the launch of the MediaTek Genio 360 Evaluation Kit (EVK), providing developers, partners, and ODMs with a powerful and accessible platform to bring next-generation AIoT and edge Generative AI (GenAI) applications to life.
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