InnoComm to Showcase Edge AI Platform at Embedded World 2026

InnoComm will participate in Embedded World 2026, taking place March 9–11 in Nuremberg, Germany. InnoComm will co-exhibit with MediaTek at Hall 3, Booth 3-539.

At the show, InnoComm will unveil Arkeon, its newest Edge AI Box platform. Arkeon supports four compute platform series and delivers scalable AI performance up to 10 TOPS, targeting smart retail, smart manufacturing, smart transportation, and AIoT deployments.

Arkeon Powered by MediaTek Genio 360(P)

A highlighted configuration runs on MediaTek's Genio 360(P), delivering AI acceleration, power efficiency, and multi-camera processing for edge deployments. This combination allows customers to develop always-on edge systems with a practical balance of AI performance, thermal efficiency, and industrial reliability.

Arkeon supports touch panel screens in standard 7-inch and 10-inch sizes, with fully customized display options up to 32 inches. This range covers use cases from interactive kiosks and retail self-service terminals to smart factory control panels and large-format digital signage.

Why Choose InnoComm as Your ODM Partner

With decades of embedded system experience, InnoComm offers end-to-end ODM services built around your product requirements:

Multi-Platform SoC Support: Flexible platform options across leading SoC ecosystems, including close collaboration with MediaTek
Embedded & Edge AI Engineering Depth: Proven experience in Edge AI, embedded computing, and industrial-grade system design
From Concept to Mass Production: Full ODM coverage from concept design and hardware/software integration through to mass production
Industrial-Grade Lifecycle Management: Stable supply planning and long product lifecycle support for industrial deployments
Optimized for Faster Deployment: Reference designs and ecosystem partnerships that reduce time-to-market

Visit Us at Embedded World 2026

Visit InnoComm at Hall 3, Booth 3-539 to experience Arkeon firsthand. Can't make it to Nuremberg? Contact us to arrange a product briefing or request more information.